We offer technological support during the design phase to help optimize production costs.
* Customer documentation is validated at the design stage
* A dedicated system tracks specific customer requirements throughout production
* Strict confidentiality standards are maintained to protect customer knowhow and documentation
* Support includes guidance on technical aspects during product development
* Documentation validation ensures alignment with production requirements
The process emphasizes cost efficiency, documentation control, and protection of proprietary information.
In summary, the content above reflects only the provided information.
Our products are compliant with RoHs directive,
REACH and conflict
minerals legislation.
We have obtained a nonflammability certificate of UL 94V0
class in accordance with the
American norm (E234136).
We have Quality Management
System certificate 90012015
issued by TÜV Rheinland.
Our employees undergo regular
IPCA600 norm trainings.
Printed circuit boards are manufactured with specified technical parameters.
• Maximum board size: 590 x 400 mm
• Minimum track width and spacing: 0.15 mm (6 mils)
• Minimum hole diameter: 0.3 mm
• Silkscreen options: white Peters, black Peters (used with white solder resist)
• Surface finishes available: HASL tinning, nickel plating, gold plating
The production process includes mechanical operations such as CNC drilling, routing, V-cut, and punching. Markings can include date, WM ELTAR logo, and client’s logo. Documentation is provided in Gerber RS-274X and drill Excellon formats.
In summary, the content above reflects only the provided information.
Production Technological Parameters
Maximum customer format – double sided PCBs:560 X 360 mm
Maximum customer format – single sided PCBs:570 x 370 mm
Minimum distance between conductor and board edge:0.5 mm
Minimum distance between tracks:0.15 mm
Minimum track width:0.15 mm
Minimum annular ring width (radius):0.2 mm
Minimum diameter of plated hole:0.3 mm
Minimum diameter of unplated hole:0.4 mm
Permissible offset between copper layer and drilling:0.15 mm
Permissible offset between solder resist and copper layer:0.1 mm
Permissible offset between legend and drilling:0.3 mm
Permissible offset peelable mask and drilling:0.3 mm
Permissible offset carbon paste and drilling:0.3 mm
Scoring line width (laminate thickness 1,55 mm):<= 0.6 mm
Scoring line relative position to nominal position shift:±0.2 mm
Upper and lower scoring line shift:±0.1 mm
Routed dimensions tolerances:±0.20 mm
Minimum distance between routing and conductor:0.30 mm
Solder resist thickness on copper:from 8 to 45 µm
HASL tin thickness :from 1 to 40 µm
ENIG gold and nickel thickness:Au from 0.05 to 0.125 μm Ni from 3.0 to 10 μm
We measure over 130 processes
and product parameters in all
production operations, in line
with our Central Control Plan.
100% of doublesided PCBs
undergo electric testing and
most PCBs undergo Automatic
Optical Inspection (AOI).
We make crosssection measurements reports of manufactured
and entrusted PCBs. We deliver
certificates of quality, and on
request PPAP lev. 2 reports, etc.
We are one of the leading
Polish PCB manufacturers for
many electronic industries.
Since 1981, we have been
constantly improving technology and machinery park.
We specialize in the production of doublesided and
singlesided PCBs on laminates FR4, MC PCB, CEM3T.
We produce 2,000 sqm of
PCBs monthly. We carry out
medium and small production batches including 48H
express orders of prototypes.