Company
- Region
- Asia-Pacific
- Country
- Japan
- Type
- Legal entity
- Source
- GLEIF Global LEI Index
- Source record
- Open source record
- LEI
- 3538003O5WZMS9H0UL10
LEI Verification
- LEI
- 3538003O5WZMS9H0UL10
- Legal name
- ＮＥＸＴ ＦＵＮＤＳ Ｓ＆Ｐ ５００ 半導体・半導体製造装置３５％キャップ指数連動型上場投信
- Entity status
- ACTIVE
- Registration status
- ISSUED
- Registered as
- T080534601
- Jurisdiction
- JP
- Last update
- 2026-03-24T00:00:22Z
- Next renewal
- 2027-03-24T00:00:00Z
Registry details
- Entity category
- FUND
- Legal form
- 9999
- Registration authority
- RA000413
- Creation date
- 2025-03-24T15:00:00Z
- Initial registration
- 2025-03-24T00:00:00Z
- Corroboration
- FULLY_CORROBORATED
- Conformity
- CONFORMING
- Validated at
- RA000413
- Validated as
- T080534601
Addresses
- 赤坂一丁目8番1号 赤坂インターシティAIR, 107-8472, 東京都 港区, JP
Buyer Contact
No verified company-level contact point is published for this profile yet. Send an RFQ through SaharaIndex so the request can be routed and supplier details can be verified.
Request Quote
Send a buyer request to SaharaIndex for routing and supplier verification for ＮＥＸＴ ＦＵＮＤＳ Ｓ＆Ｐ ５００ 半導体・半導体製造装置３５％キャップ指数連動型上場投信.
Validation
- Status
- review
- Score
- 65