Printed Circuit Boards

Production Technological Parameters

Production Technological Parameters Maximum customer format – double sided PCBs:560 X 360 mm Maximum customer format – single sided PCBs:570 x 370 mm Minimum distance between conductor and board edge:0.5 mm Minimum distance between tracks:0.15 mm Minimum track width:0.15 mm Minimum annular ring width (radius):0.2 mm Minimum diameter of plated hole:0.3 mm Minimum diameter of unplated hole:0.4 mm Permissible offset between copper layer and drilling:0.15 mm Permissible offset between solder resist and copper layer:0.1 mm Permissible offset between legend and drilling:0.3 mm Permissible offset peelable mask and drilling:0.3 mm Permissible offset carbon paste and drilling:0.3 mm Scoring line width (laminate thickness 1,55 mm):<= 0.6 mm Scoring line relative position to nominal position shift:±0.2 mm Upper and lower scoring line shift:±0.1 mm Routed dimensions tolerances:±0.20 mm Minimum distance between routing and conductor:0.30 mm Solder resist thickness on copper:from 8 to 45 µm HASL tin thickness :from 1 to 40 µm ENIG gold and nickel thickness:Au from 0.05 to 0.125 μm Ni from 3.0 to 10 μm

Category

Printed Circuit Boards

Supplier

WM ELTAR SP. Z O.O. SP. K.

Country

Poland